基本信息 |
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产品名称: | 2-(二苯基膦基)乙基三乙氧基硅烷 |
CAS: | 18586-39-5 |
中文同义词: | 2-(二苯基膦基)乙基三乙氧基硅烷 |
英文同义词: | 2-(DIPHENYLPHOSPHINO)ETHYLTRIETHOXYSILANE ; PHOSPHINE,DIPHENYL[2-(TRIETHOXYSILYL)ETHYL]- ; 2-(DIPHENYLPHOSPINO)ETHYLTRIETHOXYSILANE ; DIPHENYL(2-(TRIETHOXYSILYL)ETHYL)PHOSPHINE ; BETA-DIPHENYLPHOSPHINOETHYLTRIETHOXYSILANE ; DIPHENYL[2-(TRIETHOXYSILYL)ETHYL]PHOSPHANE |
MDL号: | MFCD00015125 |
氢键受体数量: | 3 |
氢键供体数量: | 0 |
Smile: | CCO[Si](CCP(c1ccccc1)c2ccccc2)(OCC)OCC |
InChi: | InChI=1S/C20H29O3PSi/c1-4-21-25(22-5-2,23-6-3)18-17-24(19-13-9-7-10-14-19)20-15-11-8-12-16-20/h7-16H,4-6,17-18H2,1-3H3 |
InChiKey: | InChIKey=HLXCYTXLQJWQFG-UHFFFAOYSA-N |
性质 |
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沸点: | 182 DEG C/1.3 MM |
密度: | D(20/4): 1.05 |
物理性质: | FP: 134 DEG C(273 DEG F) |
注解: | ADHESION PROMOTER FOR GOLD SUBSTRATES IN MICROELECTRONIC APPLICATIONS HYDROLYTIC SENSITIVITY: 7 IMMOBILIZING LIGAND FOR PRECIOUS METALS REACTS SLOWLY WITH MOISTURE/WATER TSCA |
安全信息 |
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