基本信息 |
|
| 产品名称: | 双(叔丁基胺)双(二甲基胺)钨(VI) |
| CAS: | 406462-43-9 |
| 中文同义词: | 双(叔丁基胺)双(二甲基胺)钨(VI) |
| 英文同义词: | BIS(TERT-BUTYLIMINO)BIS(DIMETHYLAMINO)TUNGSTEN(VI) ; BTBMW ; BIS(TERT-BUTYLIMIDO)BIS(DIMETHYLAMIDO)TUNGSTEN |
| MDL号: | MFCD07369712 |
| 氢键受体数量: | 4 |
| 氢键供体数量: | 0 |
| Smile: | CC(C)(C)N=[W](=NC(C)(C)C)(N(C)C)N(C)C |
| InChi: | InChI=1S/2C4H9N.2C2H6N.W/c2*1-4(2,3)5;2*1-3-2;/h2*1-3H3;2*1-2H3;/q;;2*-1;+2 |
| InChiKey: | InChIKey=JVCWKXBYGCJHDF-UHFFFAOYSA-N |
性质 |
|
| 沸点: | 81 DEG C/0.02 MMHG(LIT) |
| 密度: | 1.305g/mLat25°C(lit.) |
| 物理性质: | FLASHPOINT: 13 DEG C FLASHPOINT: 55.4 DEG F |
| 注解: | APPLICATION: PRECURSOR FOR THE DEPOSITION OF TUNGSTEN CARBIDE AND -NITRIDE BY ATOMIC LAYER DEPOSITION FORM: LIQUID FREQUENTLY ASKED QUESTIONS: LIVE CHAT AND FREQUENTLY ASKED QUESTIONS ARE AVAILABLE FOR THIS PRODUCT GENERAL DESCRIPTION: ATOMIC NUMBER OF BASE MATERIAL: 74 TUNGSTEN PROTOCOLS AND APPLICATIONS: PRECURSORS PACKAGED FOR DEPOSITIONS SYSTEMS RIDADR: UN 3398 4.3/PG 1 UNSPSC: 12352103 WGK: 3 |
安全信息 |
|
| 符号: |
GHS02
GHS05
|
| 信号词: | Danger |
| 危险声明: | H260-H314 |
| 警示性声明: | P223-P231 + P232-P280-P305 + P351 + P338-P370 + P378-P422 |
| 危害码: | F,C |
| 风险声明: | R:11-15-34 |
| 安全声明: | S:26-36/37/39-43-45 |
| WGK德国: | 3 |
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