basic_info |
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Product_Name: | PREFERENTIAL SILICON ETCHANT |
EnglishSynonyms: | ANISOTROPIC SILICON [110] ETCHANT ; SILICON PREFERENTIAL ETCH ; SILICON 100 ETCH ; ANISOTROPIC SILICON [100] ETCHANT ; PREFERENTIAL SILICON ETCHANT ; SILICON 110 ETCH |
pro_mdlNumber: | MFCD08705341 |
pro_acceptors: | 0 |
pro_donors: | 0 |
InChi: | InChI=1S// |
InChiKey: | InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N |
property |
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Boiling_Point: | >240 DEG C |
Density: | DENSITY: 1.001 G/ML AT 25 DEG C |
PhysicalProperty: | REFRACTIVE INDEX: N20/D 1.484 |
Comments: | APPLICATION: ETCH RATE APPROX 80MICRONS/HOUR AT AT 100 DEG C. ETCHES CLEANLY WITH ONLY A DEIONIZED WATER RINSE NEEDED. WILL NOT ETCH AU OR TA GENERAL DESCRIPTION: ETHYLENEDIAMINE BASED-FOR < 100 > CRYSTAL ORIENTATION RIDADR: UN 2922 8/PG 3 UNSPSC: 12352300 WGK: 2 |
secure_info |
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