basic_info |
|
| Product_Name： | TITANIUM ETCH |
| EnglishSynonyms： | TITANIUM ETCH ; TITANIUM ETCHANT |
| pro_mdlNumber： | MFCD08705364 |
| pro_acceptors： | 0 |
| pro_donors： | 0 |
| InChi： | InChI=1S// |
| InChiKey： | InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N |
property |
|
| MeltingPoint： | -35 DEG C |
| Boiling_Point： | 200 DEG C |
| PhysicalProperty： | VAPOR PRESSURE: 14 MMHG (20 DEG C) |
| Comments： | APPLICATION: DESIGNED FOR ETCHING EVAPORATED FILMS COMMONLY EMPLOYED AS BONDING AND BARRIER LAYERS IN MICROELECTRONICS. EXCELLENT RESOLUTION, PHOTO RESIST COMPATIBILITY, AND MINIMAL UNDERCUTTING ARE READILY ACHIEVED FEATURES AND BENEFITS: USE WITH POLYETHYLENE TANKS BETWEEN 20-50 DEG C. ETCH RATES 25ANGSTROM/SEC AT 20 DEG C, 50ANGSTROM/SEC AT 30 DEG C. RINSE WITH DI WATER RIDADR: UN 1790 8/PG 2 UNSPSC: 12352300 WGK: 2 |
secure_info |
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